Brochure
With expertise in engineering solutions,
HANA Micron offers competitive turnkey solutions for the back-end process including Bump>Wafer Test>Package>Final Test>Module.
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Bump
-
Wafer Test
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Package
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Final Test
-
Module (Assemby & Test)
Offer Customized Solution
- Package Design and Simulation
- Reliability Assessment
- Failure Analysis
- Verification
- Program Development
Diverse Package Portfolios and
Experienced Engineers
Experienced Engineers
- Flip chip
- Laminate
- Leadframe
- Wafer Level
A Competitive Market Player
based on Global Networks
based on Global Networks
- Korea
- Vietnam
- Brazil
- USA
HANA Micron supports our customers to focus on product design and wafer
production by offering the optimal solution and service that meet various requirements of our customers.
production by offering the optimal solution and service that meet various requirements of our customers.
- Size
- Thickness of package
- Performance
- Reliability
- High Density
- Cost
Full Turnkey
Solution
Solution
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Efficient management of
supply chain -
Cost reduction through
streamlined processes
and logistics -
Swift and effective
decision-making -
Shortened lead time
considering the launch of customer’s product