• WLP DSP
Process Flow

Wafer Lamination
- For Protecting Wafer Pattern and Bump Balls at B/G Process
- Available for 8″, 12″

Wafer Back Grinding
- For control of wafer thickness
- Available for 8″, 12″

Wafer Backside Coating & Cure (Optional)
- Better marking quality than bare silicon
- Low wafer warpage
- For protecting the lateral crack & backside chipping during blade sawing
- Available for 8″, 12″

Wafer Backside Marking & Tape Mount
- For Marking on Wafer Backside
- Available for 8″, 12″

Wafer Saw
- Control the parameter to prevent the topside chipping and lateral crack
- Backside coating can reduce the Backside chipping
- Available for 8″, 12″

Tape & Reel
- Picking a die up & Placing in the pocket of Carrier Tape
- Inspection for 5 sides of a Chip
- Available for 8″, 12″