- Fingerprint Sensor Assembly
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Specification
- Minimum wire loop height : 30um
- Over mold thickness control : ±15um
- High Dk EMC : Dk=4, Dk=7 available
- PCB Layer : 2layer
- Min. PCB thickness : 0.1mm thickness
- Min. PKG thickness : 0.3mm thickness
- High Glossy Surface
- PKG Polishing or No-Polishing
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Specification
- Sensor IC + Component(SMT)
- Component Size : 0402~1608
- Component : Capacitor/Resistor/TVS Diode
- PCB thickness : 0.26mm thickness
- PKG thickness : 0.7mm thickness
- PKG Polishing(Avg. Rz = 2.66)
- Unit Test / Strip Test
- Sensor IC + Amplifier + Component(SMT)
- Sensor IC + MCU + Amplifier + Component(SMT)
- Component Size : 0402~1608
- Small size SiP (FOD) : Equivalent single size
- PCB thickness : 0.26mm thickness
- PKG thickness : 0.7mm thickness
- Door lock/Laptop/Automotive application