- Flexible Package
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HANA Micron provides a flexible packaging solution, which takes advantage of electronics based ultra thin silicon wafer and this technology would be applied to wearable, flexible display, mobile and sensors.
HANA Micron offers better reliability, simulation and robust process in the flexible packaging industry.
- Versatile flexible packaging platform for realizing the optimized bending radius.
- Face up/face down & SIP structure.
- Flexible structure design using neutral plane.
- Roll transfer technology on 200mm and 300mm wafer
- Ultra thin wafer handling technology under 30um.
- Hybrid flexible interconnection technology.
- Mechanical and electrical reliability including bending and fatigue environment.
- Mechanical & electrical simulation.
Roll transfer handling system, die flip chip bonded on the flexible substrate, stretchable adhesive film laminated on the SI wafer and flexible interconnection technology.

A key to achieving this is the development of techniques to thin Si die to thicknesses less than 50μm.
The techniques have been developed to integrate ultra-thin die onto or into flexible polymeric substrates such as LCP and polyimide.

HANA Micron are developing a flexible package solution to apply for flexible display, wearable, sensor and memory such as display drive IC, CMOS image sensor and storage product. In the near future, it is expected that HANA Micron will be able to provide a flexible package solution of SIP (System in package) type as well.
