- Package Roadmap
Memory (FBGA)
Items | Available | Road Map | ||
Y2018-1H | Y2018-2H | Y2019 | ||
PKG Thickness (mm) | 0.55 | ← | 0.47 | 0.45 |
Max. Die Number | 10 | 11 | 12 | 17 |
Min. Die Thickness (um) | 40 | 30 | ← | 25 |
DAF Thickness (um) | 10 | ← | ← | ← |
PCB Thickness (mm) | 0.09 | ← | 0.08 | ← |
Mold Cap (mm) ▪ Transfer |
0.25 | ← | 0.22 | ← |
Pattern Layer (NAND) | 48stack | 64stack | ← | ← |
Flip Chip
Items | Available | Road Map | ||
Y2018-1H | Y2018-2H | Y2019 | ||
Die Size (mm) | 11.5×11.5mm | 14.0×14.0mm | 18.0×18.0mm | 20.0×20.0mm |
Bump Pitch (um) ▪ Pb Free Solder ▪ Cu Pillar + Pb Free Solder |
134.9um 60um |
130um 40um |
130um 40um |
120um 30um |
▪ Max Body size ▪ Min Ball size (Strip/Unit) ▪ Min Ball Pitch (Strip/Unit) |
35x35mm 0.15/0.25mm 0.30/0.40mm |
55x55mm 0.15/0.25mm 0.30/0.40mm |
75x75mm 0.15/0.25mm 0.30/0.40mm |
90x90mm 0.15/0.25mm 0.30/0.40mm |
Substrate |
Standard Core Low CTE Core Coreless |
- | - | - |
QFN/FLGA
Items | Available | Road Map | ||
Y2018-1H | Y2018-2H | Y2019 | ||
QFN PKG Size (mm) | 3×3~8×8 | 3×3~11×11 | 2×2~13×13 | ← |
FBGA PKG thickness(mm) | 0.45 | 0.41 | 0.35 | 0.30 |
FLGA PKG Size (mm) | 3×3~ | 2×2.5~ | 2×2~ | ← |
Overhang @50um die(mm) | 0.8 | 1.2 | 1.5 | 2.0 |
Loop Height (um) | 30 | 25 | 25 | 23 |
Bump / WLP
Items | Available | Road Map | ||||
HVM | AVM | Y2018-1H | Y2018-2H | Y2019 | ||
Wafer size | 200mm | 200mm/300mm | ||||
RDL Line & Space (Min.) | 15um/15um | 9um/9um | 9um/9um | 8um/8um | 8um/8um | |
RDL Max. thickness (Cu portion, 1chip) |
9um | 20um | 20um | 30um | ||
(≤50%) | (≤70%) | (≤70%) | ||||
PI/PBO Min. CD size(Min.) | 22um/20um | 20um/15um | 20um/12um | 15um/10um | ||
PI/PBO thickness(Max.) | 10um/10um | 20um/10um | 20um/10um | 30um/10um | 20um/10um | |
Min. Ball pitch | Ball | 400um | 350um | 300um | 250um | - |
L/F | 150um | 100um | 100um | - | - | |
Low stress solution | Reduction of wafer warpage & Bump process control | |||||
Thermal stress solution | Low cure passivation(≤ 230℃) | Low cure passivation(≤ 200℃) | ||||
High current solution | UBM thickness | 8um/10um/15um/20um |
Design
Items | Available | Road Map | ||
Y2018-1H | Y2018-2H | Y2019 | ||
Line & Space (um) | 9/12um | 10/10um | ← | 8/8um |
Via / Via Pad (um) ▪ Blind Via |
60/90um | 55/80um | ← | 50/70um |
SRO/SRR ▪ SR Open ▪ SR Registration ▪ SOP Pitch |
70±10um 130um |
60±9.5um 110um |
← |
<60±9.5um 100um |
Stack Via | 2~4 Stack | 5 Stack | ← | 6 Stack |
Core Material | E700/705G,R1515W | E770G, R1515U | ← | Low CTE New material |
Build-Up Material | GX13, GX92 | GZ41, GL102 | ← | GX-T37, GY16B |
Solder Mask Material | AUS703, SR1 | SR2, FZ2700 | ← | SR3, SR-FB |
Surface Finish | ENIG,OSP, IT, ENEPIG | Selective ENEPIG | ← | Low cost Chemical |