Memory (FBGA)

Items Available Road Map
Y2018-1H Y2018-2H Y2019
PKG Thickness (mm) 0.55 ← 0.47 0.45
Max. Die Number 10 11 12 17
Min. Die Thickness (um) 40 30 ← 25
DAF Thickness (um) 10 ← ← ←
PCB Thickness (mm) 0.09 ← 0.08 ←
Mold Cap (mm)

▪ Transfer		 0.25 ← 0.22 ←
Pattern Layer (NAND) 48stack 64stack ← ←
Flip Chip

Items Available Road Map
Y2018-1H Y2018-2H Y2019
Die Size (mm) 11.5×11.5mm 14.0×14.0mm 18.0×18.0mm 20.0×20.0mm
Bump Pitch (um)

▪ Pb Free Solder

▪ Cu Pillar + Pb Free Solder 		 

134.9um

60um 		 

130um

40um 		 

130um

40um 		 

120um

30um
▪ Max Body size

▪ Min Ball size (Strip/Unit)

▪ Min Ball Pitch (Strip/Unit) 		35x35mm

0.15/0.25mm

0.30/0.40mm 		55x55mm

0.15/0.25mm

0.30/0.40mm 		75x75mm

0.15/0.25mm

0.30/0.40mm 		90x90mm

0.15/0.25mm

0.30/0.40mm
Substrate Standard Core

Low CTE Core

Coreless 		- - -
QFN/FLGA

Items Available Road Map
Y2018-1H Y2018-2H Y2019
QFN PKG Size (mm) 3×3~8×8 3×3~11×11 2×2~13×13 ←
FBGA PKG thickness(mm) 0.45 0.41 0.35 0.30
FLGA PKG Size (mm) 3×3~ 2×2.5~ 2×2~ ←
Overhang @50um die(mm) 0.8 1.2 1.5 2.0
Loop Height (um) 30 25 25 23
Bump / WLP

Items Available Road Map
HVM AVM Y2018-1H Y2018-2H Y2019
Wafer size 200mm 200mm/300mm
RDL Line & Space (Min.) 15um/15um 9um/9um 9um/9um 8um/8um 8um/8um
RDL Max. thickness

(Cu portion, 1chip)		 9um 20um 20um 30um
(≤50%) (≤70%) (≤70%)
PI/PBO Min. CD size(Min.) 22um/20um 20um/15um 20um/12um 15um/10um
PI/PBO thickness(Max.) 10um/10um 20um/10um 20um/10um 30um/10um 20um/10um
Min. Ball pitch Ball 400um 350um 300um 250um -
L/F 150um 100um 100um - -
Low stress solution Reduction of wafer warpage & Bump process control
Thermal stress solution Low cure passivation(≤ 230℃) Low cure passivation(≤ 200℃)
High current solution UBM thickness 8um/10um/15um/20um
Design

Items Available Road Map
Y2018-1H Y2018-2H Y2019
Line & Space (um) 9/12um 10/10um ← 8/8um
Via / Via Pad (um)

▪ Blind Via 		60/90um 55/80um ← 50/70um
SRO/SRR

▪ SR Open

▪ SR Registration

▪ SOP Pitch 		70±10um

130um 		60±9.5um

110um 		← <60±9.5um

100um
Stack Via 2~4 Stack 5 Stack ← 6 Stack
Core Material E700/705G,R1515W E770G, R1515U ← Low CTE New material
Build-Up Material GX13, GX92 GZ41, GL102 ← GX-T37, GY16B
Solder Mask Material AUS703, SR1 SR2, FZ2700 ← SR3, SR-FB
Surface Finish ENIG,OSP, IT, ENEPIG Selective ENEPIG ← Low cost Chemical