WLCSP
  • Specification

    - Wafer size : 200mm
    - Passivation : Polyimide
    - Bump Structure
      : 1st PSV + RDL + 2nd PSV + UBM + Solder
    - Ball pitch : ≥ 400㎛
    - Marking : Wafer level green laser marking
    - Pack/ship options : Tape & Reel(T&R)
      * Option : Laser groove

  • Features

    - RDL Thickness : 5㎛ ~30㎛
    - RDL metal area : 70%/chip(Plated Cu)
    - Ball counts : 4~136 balls
    - Chip size from min. 0.48mm x 0.76mm
    - Bump ball size : below 250μm

  • Applications

    - High power management IC
    - Quick charger IC
    - Automotive infotainment IC

F/C Bump
  • Specification

    - Wafer size : 200mm
    - Bump Structure : Cu post + Ni + Solder cap.
    - Pad pitch : ≥ 50㎛, Bump Diameter 35㎛~150㎛
    - Marking : Wafer level green laser marking
    - Pack/ship options : Wafer, T&R, Flip chip package
      * Option : Passivation , RDL

  • Features

    - Bump edge to die edge : ≤ 50μm
    - Cu Pillar Height : 100㎛ ~ 120㎛

  • Applications

    - High power devices application
    - Sensor devices application