• Fingerprint Sensor
Single Chip & Semi-Glossy 넂 SiP FPS & High Glossy

Process Item Available 1H 2018 Key Technology
Die Attach Die Tilt 돞30um 돞15um Substrate Flatness
Mold Surface Semi-Glossy High-Glossy I/M & Low CTE
High Dk Dk = 4 & 7 Dk = 9, 13, 20 Alumina filler Mold
Shrinkage 돞0.23 돞0.14 Raw Material development
PKG Grind Thickness 70um(Over Mold)
30(FC FPS)
50(Over Mold)
15(FC FPS)
Grind Wheel & Condition
Fingerprint Sensor Market Needs 넂 Thin, Low Cost, Ultrasonic FPS
Application Needs
Korea Process Expansion
  - PKG To Unit Cutting
Under Glass
  - Ultrasonic FPS
China Thin Profile
  - 돞0.27 TSV Thin PKG
New Application
  - Door Lock, Laptop
USA
EU
Thin Profile
  - 돞0.25 TSV Thin PKG
Durability & ESD
  - High ESD 넂 Capton Film
Low Cost
  - Low Cost QFN FPS
Assembly Capability

Critical To Quality Fingerprint Key Control Item
Available Tolerance [um] HVM [um] Cpk
Die Thickness (excluding PI coating) 50 +/-5 170 1.74 Auto TTV
Die Thickness (including PI coating) 60 +/-5 180 1.74
Wire loop Height 0.6mil 30 +/-5 35 3.15 Bond Pad Loop Height
Chip Edge Loop Height
0.7mil 3 0 +/-5 35 3.18
Mold Thickness EMC Filler : Max.20um 200 +/-15 275 1.38 C-mold Control
Substrate Thickness - 130 <200: 20
>200: 40
300 2.80 Flatness
Over mold Thickness EMC Filler : Max.20um 50 +/-10 50 N/A C-mold Control