SiP Capability

Development procedure of SiP

Turnkey service for various SiP module

System design : Comparison of RF characteristics (BLE Module)

System design : Small form factor (WiFi 802.11 b/g/n + 8M Flash)

Test : Turnkey test for system level

EMI conformal shield

System-in-package (SiP) is the trend for wireless electronic products, which develop gradually lighter, thinner and even more compact.
These trendencies could result in significant noise issues in SiP modules, such as electro-magnetic interference (EMI).

- EMC problems solved at the source cause the lowest costs and the most effective solutions.
- EMC problems solving at the coupling path or load is expensive, ineffective and sometimes simply not possible.

EMI conformal shield : Process flow