QFN / Quad Flat No lead Package
  • Specification

    – Die Thickness (max) : 3.0mil ~ 10.0mil
    – Wire diameter : 0.7 ~ 1.2mil
    – Marking : Laser
    – Lead inspection : Optical
    – Mold Cap : 0.35 ~ 0.65mm
    – Pack/ship options : JEDEC Tray

Description

HANA Micron’s Quad Flat No lead (QFN) is based PPF leadframe PKG to have strong reliability , and it is a near chip scale PKG with plastic overmolded encapsulation. This package has many benefits including reduced lead inductance, a small size, thin profile and low weight. And the exposed die paddle on the bottom of PKG offers good thermal and electrical performance. HANA Micron’s QFN will be able to meet your requests for the strong reliability, thin thickness, small size, low weight, and thermal and electrical performance , etc.

  • Features

    - 8 to 88 lead counts available
    - 2mm ~ 10mm body size available
    - Thin, lightweight, space saving package
    - JEDEC standard compliance
    - Pb-Free, RoHS compliant & Green BOM
    - Wide range of open tool substrate available
    - Good thermal & electrical performance

  • Applications

    - Analog
    - ASIC
    - Wireless RF
    - MEMS
    - Cell Phone
    - Notebook

TSOP / Thin Small Outline Package
  • Specification

    – Die Thickness (max) : 11 12 mil
    – Stack Die Thickness : 3mil
    – Strip Solder plating : 85/15 Sn/Pb, Sn/Bi, Matte Sn
    – Wire diameter : 1.0 mil or 0.8 mil
    – Marking : Laser
    – Lead inspection : Optical
    – Pack/ship options : Tape & Reel, Tube, JEDEC Tray
    – Bond pad pitch : 0.08mm
    – Coplanarity (max) : 0.08 mm

Description

HANA Micron offers a full family of popular Thin Small Outline Package (TSOP). Small and thin, these 1.0 mm body packages were designed and introduced to operate reliably in a variety of environments. Surface Mount technology (SMT). TSOP is available in a thermally enhanced version (TSOP-ep), as well as a stacked die version (TSOP-SD). Die stacking is available from 2 to 4 die, with bonding pads on two sides of the die or single-sided bonding pads. Particular attention was focused on material sets and assembly processes to address user issues such as flatness, coplanarity, wire sweep, delamination, solderability and more.

  • Features

    - 48 lead counts for TSOP1
    - 50 to 66 lead counts for TSOP2
    - 12횞18.40mm package sizes for TSOP1
    - 10.16횞20.95 to 10.16횞22.22mm package sizes for TSOP2
    - 0.50mm lead pitch available
    - Hi-conductivity copper leadframes
    - JEDEC standard compliance
    - Precisely controlled wire loop height
    - Enhanced design for memory applications
    - Lead-free and Green materials sets available

  • Applications

    - Memory
    - RF / Wireless
    - Logic and Linear
    - Controller
    - OP Amp
    - Networking equipment

TSSOP / Thin Shrink Small Outline Package
  • Specification

    – Die Thickness (max) : 10-12 mil
    – Strip Solder plating : Lead Free : Sn/Bi, Matte Sn
    – Wire diameter : 1.0 mil or 0.8 mil
    – Marking : Laser
    – Lead inspection : Optical
    – Pack/ship options : Tape & Reel, Tube, JEDEC Tray
    – Coplanarity (max) : 0.08 mm

Description

TSSOP(Thin Shrink Small Outline Package) is 0.9mm thickness and 0.40~0.65mm lead pitch package shrinked from TSOP Type 2. It requires high reliable material, equipment, process, and technologies.

  • Features

    - 14 to 20 lead counts for TSSOP
    - 4.4*5.0~6.5 package sizes
    - 0.40~0.65mm lead pitch available
    - Hi-conductivity copper leadframes
    - JEDEC standard compliance
    - Lead-free and Green materials sets available

  • Applications

    - Controller
    - OP Amp
    - Analog
    - Logic

QFP / Quad Flat Package
  • Specification

    – Die Thickness (max) : 15 22 mil
    – Wire diameter : 0.8 mil 1.0 mil
    – Marking : Laser
    – Lead inspection : Optical
    – Pack/ship options : JEDEC Tray
    – Lead pitch : 0.4mm ~ 1.0mm

Description

Quad Flat Package (QFP) is one of the most widely used packages in almost every electronic application. HANA Micron’s QFP is a lead frame based PKG with gull wing type leads on four sides and it is SMD type. This package has some advantages like good thermal & electrical performance. HANA Micron’s QFP is enough to meet your requests for a variety of body sizes, lead pitch and strong reliability.
– LQFP : 1.2 ~1.6mm PKG thickness
– TQFP : < 1.2mm PKG thickness

  • Features

    - 24 to 128 lead counts available
    - 8X13.4mm ~ 12X20mm body size available
    - Thin, lightweight package
    - JEDEC standard compliance
    - Pb-Free plating options
    - Good electrical & thermal performance

  • Applications

    - Analog
    - ASIC
    - DSP
    - PLD
    - SENSORS
    - Micro-Controllers